Ardex AF 180 Glue

Preparation of the substrate:

The substrate as well as the room climatic conditions must meet the requirements of DIN 18365. Subfloors must be even, permanently dry, solid, free of cracks, impurities and adhesion-inhibiting substances. substances.

Level uneven substrates with appropriate ARDEX levelling compounds. fill. The technical information of the primers and leveling compounds must be observed.

Mastic asphalt screeds and other plasticizer-sensitive substrates must be must be precoated with ARDEX PU 30 and, if necessary, filled with a suitable with suitable ARDEX levelling compounds in a layer thickness of at least 3 mm. of at least 3 mm.

Chipboard and wooden subfloors must be firmly bonded to the substrate and and glued in tongue and groove.

Processing:

Apply adhesive evenly to the substrate using a notched trowel whereby adhesive nests are to be avoided. Lay the covering within the the laying time, the reverse side of the covering must be sufficiently wetted with adhesive. On non-absorbent substrates, a relative humidity of at least of at least 50 % is required. Apply adhesive with appropriate Apply adhesive to the substrate with appropriate toothing and allow to flash-off for allow to react for approx. 20 min. The covering is to be laid only after the skin formation. Alternatively, prepare the surface with suitable ARDEX filler.

When laying sheet flooring, a flash-off time of the adhesive of approx. of approx. 10 - 20 min is recommended to minimize squeezing of the adhesive bed. minimize squeezing of the adhesive bed.

Roll the coverings again after approx. 1 hour. The laid surfaces should not be walked on directly for the first 4 - 6 hours. walked on for the first 4 - 6 hours.